ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,730, issued on April 14, was assigned to NATIONAL CENTER FOR ADVANCED PACKAGING Co. LTD. (Wuxi, China) and SHANGHAI XIANFANG SEMICONDUCTOR ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,732, issued on April 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Power electronics carrier" was invented by ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,732, issued on April 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Power electronics carrier" was invented by ... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,733, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with collapse control features" was invent... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,733, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with collapse control features" was invent... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,734, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and m... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,734, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and m... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,735, issued on April 14, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Device with airgap structure" was invented by Uppili S.... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,735, issued on April 14, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Device with airgap structure" was invented by Uppili S.... और पढ़ें
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,736, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Shield to reduce substrate electromagnetic interference and w... और पढ़ें